| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 26.11. | Interview: Post-Quantum Cryptography and the Future of Embedded Security | ||
| 26.11. | 'Daft' US semiconductor patent proposal is another front in the China trade war | ||
| 26.11. | FIREFLY IRED upgrade boosts AR/VR eye-tracking performance | ||
| 25.11. | Post-quantum cryptography in vehicles: Why now is the right time | ||
| 25.11. | SuperQ MOSFETs set new safety benchmark for high-voltage battery packs | ||
| 24.11. | GSMA Warns 6G Will Require up to Triple Today's Mid-band Spectrum | ||
| 24.11. | EU approves €450M boost for Onsemi's SiC power chip plant | ||
| 24.11. | IAR and Quintauris partner on functional safety software for RISC-V automotive systems | ||
| 24.11. | Infineon CoolGaN technology boosts next-gen Enphase microinverters | ||
| 23.11. | ECSA releases 2025 skills strategy report | ||
| 23.11. | OpenAI-Foxconn team-up targets next-gen AI hardware manufacturing | ||
| 22.11. | China advances wafer-scale 2D semiconductor FPGA research | ||
| 22.11. | SEMI Europe issues recommendations for the next European Chips Act | ||
| 22.11. | STM32V8 pushes 18nm microcontroller tech into new performance territory | ||
| 21.11. | Ethernet drives into the software defined vehicle | ||
| 21.11. | EV battery cooling for faster charging with Hydrohertz's Dectravalve | ||
| 21.11. | Nokia and NestAI advance physical AI with €100M partnership | ||
| 21.11. | Webinar: The Future of Physical AI with Edge Impulse | ||
| 21.11. | TriC3-equipped motor gate driver for reduced FET heat and EMI | ||
| 21.11. | Megawatt charging test system targets next-gen EV development | ||
| 20.11. | Acoustic Drone Detection | ||
| 20.11. | Last call: Register now for the Elektor conference on post-quantum cryptography | ||
| 20.11. | Microchip expands 10BASE-T1S portfolio to accelerate zonal architecture adoption | ||
| 20.11. | NVLink Fusion joins Arm Neoverse for next-gen AI data centers | ||
| 19.11. | Molex eHV60 high-voltage connector targets auxiliary EV systems |