Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
Fr | CHIPS award would support Amkor's $2B packaging and test in Arizona | ||
Fr | Lambda launches on-demand cloud access to Nvidia H100 GPUs | ||
Do | Facing earnings Tuesday, AMD sees slight launch delay in Ryzen 9000 desktop chips | ||
Di | Nvidia eyes Llama 3.1 to help enterprises build AI 'supermodels' | ||
Di | Lattice pushes low-power limits in a competitive FPGA market | ||
Mo | Best of Sensors 2024: Winner HaiLa on quest to zap batteries with backscatter tech | ||
19.07. | 2023 MEMS commercialization grade weighs in at B-minus again | ||
19.07. | Banking electronic chips for the next boom (or bust) | ||
19.07. | IBM researchers work on new ways to optimize AI inference | ||
19.07. | Software-Defined Vehicles are driving computing, networking changes | ||
18.07. | Hybrid quantum-classical supercomputing is becoming a thing | ||
18.07. | Paris 2024 Olympics to open with chatbot for 11k athletes powered by Intel | ||
17.07. | The Gen AI smartphone revolution is already underway, IDC says | ||
16.07. | Silicon batteries are scaling up | ||
15.07. | Wi-Fi HaLow moves forward after completing WBA field trials | ||
15.07. | Samsung speeds production of AI chips, making use of new GAA tech | ||
15.07. | Dell now shipping PowerEdge with AMD MI300X accelerators | ||
12.07. | Microchip eyes skrocketing market for spaceflight computing | ||
11.07. | $1.6B competition aims to aid advanced packaging projects | ||
10.07. | AMD acquires Silo AI, continues to build AI case vs. Nvidia | ||
09.07. | Las Vegas Sphere becomes another showcase for Nvidia GPUs | ||
09.07. | Microsoft puts new tools in the hands of chemical scientists | ||
02.07. | Marvell addresses AI's intra-data center connectivity challenges | ||
01.07. | Moving data through metal wirelessly: Is that even possible? | ||
01.07. | Sensors Converge: TDK Invensense's SmartSound microphones |